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Manufacturing and Design of Integrated Sensors Systems (HEIS) (V2/Ü2)

Instructor: Prof. Dr.-Ing. Andreas König

Lab/Exercises: Prof. Dr.-Ing. Andreas König and research assistants

Consultations: During the lecture period every Monday, 13:00-14:00, 12/455, else according to bulletin announcement or personal appointment (koenig@eit.uni-kl.de)

Contents:

Qualification aims:

• Understanding of the required microtechnological processes, methods, descriptions and tools for computer-aided modelling, simulation and manufacturing of integrated sensor systems
• Overview of typical integrated sensor concepts and building blocks, their corresponding properties and their integration with electronics
• Conceptual understanding and mastery of a design system (SoftMEMS/Cadence DFW II in conjunction with common manufacturing technologies (EUROPRACTICE))
• Ability of the independent realization of an individual design project or a subproject in the context of a larger group project (MPC/MUMPS)

Teaching contents:

• Structure and design principles of standard CMOS-compatible sensors (2D/3D-image sensors, color- and  NIR-sensors etc.)
• Sensor architectures and compensation of deviations and cross-sensitivities
• Extension of standard technologies by additional processing steps, e.g., to achieve pressure- or fingerprint sensors
• Manufacturing technologies and -procedures of silicon-micromaching (Surface- and bulk-micromachining)
• Overview of further common procedures of MEMS/electronics for manufacturing, packaging and system integration
• Scaling - and process issues (yield/tolerances)
• Overview of common integrated sensor cells
• Inspiration from Bionics
• Design methodology and tools of computer-aided design for microsensors/MEMS
• Modelling and simulation techniques (e.g., different energy domains, FEM-concept)
• Design concepts for application-specific sensor cells and their integration with elektronics: Selection, sizing, simulation, layout, extraction, post-layout
• Feedback architectures for sensor systems
• Overview of mikroactuators in the context of microsensors
• Energy consumption & supply/self-sufficientMEMS
• (Eigen- or self-)calibration, rekonfiguration, self-monitoring/-repair in integrated sensor system, adaptation,

Readings

1. Marc J. Madou, Fundamentals of Microfabrication – The Science of Miniaturization, 2nd ed., CRC Press, 2002.
2. Mohammed Gad-el-Hak, The MEMS-Handbook, CRC Press, 2002.
3. Barth, Humphrey, Secomb (eds.), Sensors and Sensing in Biology and Engineering, Springer, 2003.
4. M. Kasper, Mikrosystementwurf – Entwurf und Simulation von Mikrosystemen, Springer 2000.
5. T. Elbel, Mikrosensorik - Eine Einführung in Technologie und physikalische Wirkungsprinzipien von Mikrosensoren, Vieweg, 1996.
6. W. Nachtigall, Kurt G. Blüchel, Bionik – Neue Technologien nach dem Vorbild der Natur, DVA, 2000.

Prerequisites:

TESYS (mandatory) , Messtechnik II

Associated courses :

Neurocomputing

Following courses :

Master project (Studien- oder Diplomarbeit)

Examination:

Oral examination based on semester project. In a computer-based accompanying lab, students become acquainted with employing the presented methods using Cadence DFW II and SoftMems Explorer. Topics for semester projects, as individual or group projects will be given to students, which shall be elaborated, documented, and presented. The projects focus on the design and implementation of an integrated sensor with analog/mixed-signal electronics employing a technology available via EUROPRACTICE foundry services. The work will be presented (20 min. slide presentation, get ISE ppt-style here), discussed, and assessed in the oral examination.

Selected semester projects :

	Martin Krämer	3D Range Sensor using time of flight method	2008
	Martin Hetterich	Design of a Spiking Pixel Cell and Image Sensor	2008
	Jürgen Hornberger	Design of a PMOS-Switch based Active Pixel Cell/Matrix	2008
	Robert Freier	Design of a Reconfigurable Logarithmic Pixel Cell/Matrix	2008
	Jiawei Yang	Design of an Active Pixel Cell/Matrix with Dedicated Sensitive Area Shape	2008
	Abhay Chandra K.	Design of an Active Pixel Cell/Matrix using PMOS Source Follower	2008
	Mahesh Poolakaparambil	Design of An Image Sensor with Well Photo Diode	2009
	Shang Kuang	Design of an Integrated Image Sensor System	2009
	Kai Lutz	Design of a Wide Dynamic Range Active Pixel Sensor Using Self-Reset Technique	2009
	Lukas Birkenmeier, Amira Ghezal, and Luis Pena	Design of a 192x32 Active Pixel Sensor in 0.35um CMOS Technology	2023

Eight of the 2008 individual design projects joined in a global effort to design a multi-project image sensor comprising the individual pixel matrices and the required additional infrastructure including a suitable pad frame. Tentative layout of the MPC 2009:

Course number: 85-650

Course materials :

For the course participants, lecture slides (ppt/pdf) and exercises (tutorials & tasks) based on Cadence DFW II and Mems-tool-enhancements are provided. The access information will be proliferated in the lecture. The materials are exclusively made available to the students of this course and can be subject to copyright of different holders without further explicit mentioning. Reprint of the course materials, dissemination of the course materials to third parties, and proliferation of the access information is prohibited without written consent of the course instructor, Prof. A. König, as well as copyright holders of the original materials donated for the purpose of teaching to a limited group.